Lighting device and method of manufacturing the same

ABSTRACT

In a first aspect of the present invention, a lighting device includes a light-emitting element, a frame including a phosphor that can be excited by light emitted from the light-emitting element, the frame having an inner side surface surrounding the light-emitting element and an outer side surface being positioned outside the inner side surface that demarcates a quadrilateral area, and a light-transmitting resin arranged in the quadrilateral area demarcated by the inner side surface of the frame and sealing the light-emitting element that is positioned inside the quadrilateral area, and the light-transmitting resin being further provided in contact with an outer side surface of the frame. In some embodiments, it is disclosed that the light-transmitting resin provided in contact with the outer side surface of the frame may include a diffuser.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims the priority benefit of JapanesePatent Application No. 2012-124874, filed on May 31, 2012, thedisclosure of which is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a lighting device including alight-emitting element and a phosphor layer that surrounds thelight-emitting element, and also relates to a method of manufacturing alighting device including a light-emitting element and a phosphor layerthat surrounds the light-emitting element.

2. Description of the Related Art

It is laid open to the public that a light-emitting diode includes alight-emitting element, a circuit substrate on that the light-emittingelement is mounted, a sealing resin that seals the light-emittingelement on the circuit substrate, and a frame including a phosphor anddisposed to surround the sealing resin (For reference, see JapaneseUnexamined Patent Application Publication No. 2010-45248). Also, thisJapanese Unexamined Patent Application Publication discloses that thelight-emitting diode includes a reflecting sheet disposed on an uppersurface of the sealing resin.

Regarding a reflecting sheet, there is another application publication,which also discloses a reflecting layer made of a metallic layer anddisposed on an upper surface of the sealing resin (For reference, seeJapanese Unexamined Patent Application Publication No. 2004-304041).

In addition, it is laid open to the public that a semiconductorlight-emitting device includes a semiconductor light-emitting element, asubmount to place the semiconductor light-emitting element thereon, asealant to seal the semiconductor light-emitting element over thesubmount, and a reflective layer provided on a side surface of thesealant, provided that a light-emitting surface of the sealant is anupper surface (For reference, see International Patent Publication No.WO 2009/066430). Also, it is disclosed that the semiconductorlight-emitting element of the semiconductor light-emitting device iscoated with a phosphor layer. This International Patent Publication alsodiscloses a method of manufacturing the semiconductor light-emittingdevice.

Furthermore, it is laid open to the public that a method formanufacturing light emitting diode devices with molded reflection framescollectively (For reference, see Japanese Unexamined Patent ApplicationPublication No. 2002-368281).

SUMMARY OF THE INVENTION

In a first aspect of the present invention, a lighting device includes alight-emitting element, a frame including a phosphor that can be excitedby light emitted from the light-emitting element, the frame having aninner side surface surrounding the light-emitting element and an outerside surface being positioned outside the inner side surface thatdemarcates a quadrilateral area, and a light-transmitting resin arrangedin the quadrilateral area demarcated by the inner side surface of theframe and sealing the light-emitting element that is positioned insidethe quadrilateral area, and the light-transmitting resin being furtherprovided in contact with the outer side surface of the frame.

In some embodiments, it is disclosed that the light-transmitting resinprovided in contact with the outer side surface of the frame may includea diffuser.

Also, it is disclosed that the outer side surface of the frame iscovered by the light-transmitting resin.

In a second aspect of the present invention, a method manufacturing alighting device includes; mounting light-emitting elements on asubstrate assembly and electrically connecting the light-emittingelements to the substrate assembly; sealing the light-emitting elementson the substrate assembly by a light-transmitting resin to form alight-transmitting resin assembly; dicing the light-transmitting resinassembly vertically and horizontally to form grooves that surrounds thelight-emitting elements; and filling a phosphor-containing resin intothe grooves to form a frame assembly that includes frames of thephosphor-containing resin and to form a light-transmitting assemblage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a lighting device related to afirst embodiment and a second embodiment of the present invention.

FIG. 2 is a top perspective view of a lighting device according to thesecond embodiment of the present invention.

FIG. 3 is a cross-sectional view taken along a line of the lightingdevice shown in FIG. 2.

FIG. 4 is a top plan view of a lighting device related to the firstembodiment and the second embodiment of the present invention.

FIG. 5 is a top perspective view of a lighting device according to athird embodiment of the present invention.

FIG. 6 is a cross-sectional view taken along a line VI-VI of thelighting device shown in FIG. 5.

FIG. 7 is a top perspective view of a lighting device according to afourth embodiment of the present invention.

FIG. 8 is a cross-sectional view taken along a line VIII-VIII of thelighting device shown in FIG. 7.

FIG. 9A to FIG. 9D show a first method embodiment according to method ofmanufacturing a lighting device related to the first embodiment oflighting device and the second embodiment of lighting device of thepresent invention.

FIG. 9A to FIG. 9E show a second method embodiment according to methodof manufacturing a lighting device related to the lighting device shownin FIG. 5.

FIG. 9A to FIG. 9E′ (instead of 9E) show a third method embodimentaccording to method of manufacturing a lighting device related to thelighting device shown in FIG. 7.

FIG. 10 is a cross-sectional view of a lighting device according to afifth embodiment of the present invention.

FIG. 11 is a top plan view of the lighting device shown in FIG. 10 withthe light-reflecting layer removed.

FIG. 12A to FIG. 12D show a fourth method embodiment according to methodof manufacturing alighting device related to the lighting device shownin FIG. 10 and FIG. 11.

FIG. 13A to 13F show a fifth method embodiment according to methodmanufacturing a lighting device collectively.

DETAILED DESCRIPTION OF THE EMBODIMENTS

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”,“comprising,” “includes”, “including”, “has” and/or “having” when usedherein, specify the presence of stated features, integers, steps,operations, elements, components, and/or portions of an element, but donot preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, portions, and/orgroups thereof.

Furthermore, as used herein, the term “light-emitting element” may beused as a light-emitting diode (LED) element including a first electrodeand a second electrode as a bare chip in some embodiments. The bare chipmay be a wafer-level chip. The term “light-emitting element” may be usedas an LED element electrically connected to a lead-frame. In otherembodiments, the term “light-emitting element” may be used as an LEDpackage including one or more LED elements arranged on a substrate.Also, it is possible to replace a light-emitting element shown in anembodiment of the present invention by an LED package, for example.

Furthermore, as used herein, the term “frame” is herein used to indicatea frame including a phosphor that can be excited by light emitted from alight-emitting element.

Relative terms such as “below” or “above” or “upper” or “lower” or “top”may be used herein to describe a relationship of one element, layer orregion to another element, layer or region as illustrated in thefigures. It will be understood that these terms are intended toencompass different orientations of a device in addition to theorientation depicted in the figures.

A lighting device according to an embodiment of the present inventionincludes a light-emitting element, a frame including a phosphor that canbe excited by light emitted from the light-emitting element andsurrounding the light-emitting element. The frame has an inner sidesurface surrounding the light-emitting element and an outer side surfacethat is positioned outside of the inner side surface. The inner sidesurface and the outer side surface of the frame are positioned oppositeto each other. The lighting device according to an embodiment of thepresent invention further includes a light-transmitting resin arrangedin contact with the inner side surface of the frame and arranged incontact with the outer side surface of the frame.

Embodiments of the invention now will be described more fullyhereinafter with reference to the accompanying drawings, in whichembodiments of the invention are shown. This invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein. Rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the invention to those skilled in the art.

Embodiments of the invention are described with reference to drawingsincluded herewith. Same and/or similar reference numbers refer to sameand/or similar structures throughout. It should be noted that thedrawings are schematic in nature.

FIG. 1 shows a schematic perspective view of a lighting device 100,which is related to a first embodiment and a second embodiment of thepresent invention.

The lighting device 100 includes a light-emitting element 1, a frame 3including a phosphor 2 that can convert light emitted from thelight-emitting element 1. The phosphor can be excited by light emittedfrom a light-emitting element 1 and can emit light in area of spectrumdifferent from area of spectrum of light emitted from the light-emittingelement 1.

The frame 3 has an inner side surface 3 c surrounding the light-emittingelement 1 and an outer side surface 3 d that is positioned outside theinner side surface 3 c. For more details, the inner side surface 3 c andthe outer side surface 3 d of the frame 3 are positioned opposite toeach other. The frame 3 includes a phosphor layer 32 that may have arectangular shape when viewed from a side of a lighting device 100. Thephosphor layer 32 may have a linear shape when viewed from top of thelighting device 100. The frame 3 in this embodiment further may includea crossing portion 31 at a corner of the frame 3. The crossing portion31 of the frame 3 is a portion where two phosphor layers 32 cross eachother. The crossing portion 31 may be provided at a corner of the frame3. The frame 3 may be a combination of four phosphor layers 32. That is,two pairs of parallel phosphor layers 32 crisscrossing to form aquadrilateral shape.

In this embodiment, the frame 3 includes four phosphor layers 32demarcating a quadrilateral area 40 with the light-emitting element 1centered when viewed from above.

The light-emitting element 1 can be selected from light-emittingelements that emit various color of light. For example, thelight-emitting element 1 may be a blue light-emitting element. It ispossible to arrange an ultraviolet light-emitting element as thelight-emitting element 1. Furthermore, the light-emitting element can bea red light-emitting element, a green light-emitting element or a yellowlight-emitting element. A phosphor 2 that can be excited by lightemitted from the light-emitting element 1 may be selected and used inthe frame 3. For example, when a blue light-emitting element 1 is usedas the light-emitting element 1, a YAG (yttrium aluminum garnet)phosphor that can be excited by light emitted from the bluelight-emitting element may be used, however, various combinations of alight-emitting element and a phosphor that includes RGB (red green blue)phosphor are available.

The quadrilateral area 40 may be a square area or a rectangular area.The light-emitting element 1 is arranged in a center of quadrilateralarea 40. In this embodiment, the frame 3 includes four crossing portions31 positioned at four corners of the frame 3. FIG. 1 is used to explaina configuration of a lighting device related to a first embodiment and asecond embodiment according to the present invention.

Also, the lighting device 100 may include a light-transmitting resin 4arranged in the quadrilateral area 40 demarcated by the inner sidesurface 3 c of the frame 3. The light-emitting element 1 positionedinside the quadrilateral area 40 and sealed by the light-transmittingresin 4. The light-transmitting resin 4 in this embodiment is made of atransparent or translucent resin without a phosphor 2. Thelight-transmitting resin 4 may be further arranged in contact with anouter side surface 3 d of the frame 3.

Accordingly, the phosphor layers 32 of the frame 3 are covered by thelight-transmitting resin 4 at the inner side surface 3 c and the outerside surface 3 d of the frame 3. With this configuration, it may bepossible to prevent the frame 3 including a phosphor 2 from beinggradually affected by exposure to air. Light emitted from thelight-emitting element 1 is configured to pass through the frame 3 fromthe inner side surface 3 c to the outer side surface 3 d of the frame 3.The inner side surface 3 c of the frame 3 may include four inner sidesurfaces 3 c with the four phosphor layers 32 around the light-emittingelement 1. Also, the outer side surface 3 d may include four outer sidesurfaces 3 d with the four phosphor layers 32 positioned outside of thefour inner side surfaces 3 c.

It is possible to arrange the phosphor layers 32 that are positioned toface the peripheral side surface 1 c of the light-emitting element 1 tohave a substantially same thickness to each other in direction facingthe peripheral side surface 1 c of the light-emitting element 1.

Furthermore, as a variation, the light-transmitting resin 4 that isprovided in contact with the outer side surface 3 d of the frame 3 mayinclude a diffuser. The diffuser used in the light-transmitting resin 4′that is provided in contact with the outer side surface 3 d of the frame3 can be any solid particle that is known to diffuse light moreefficiently. The diffusing particle may be made of silicon dioxide(SiO₂), for example. Also, titanium dioxide (TiO₂) may be used as adiffusing particle. The light-transmitting resin provided in contactwith the outer side surface 3 d of the frame 3 and includes the diffuseris shown as 4′ in FIG. 4.

Accordingly, light emitted laterally out of the phosphor layer of theframe 3 can be diffused by the diffuser included in thelight-transmitting resin 4′ that is provided in contact with the outerside surface 3 d of the frame 3 efficiently.

Also, it is possible to arrange a distance between the inner sidesurface 3 c of the frame 3 and the peripheral side surface 1 c of thelight-emitting element 1 to be constant.

Accordingly, it may be possible to suppress the occurrence of variationsof light emitted through the phosphor layers 32 of the frame 3 inlateral directions.

The lighting device may further include a substrate 7 on that thelight-emitting element 1 can be mounted. The substrate 7 may include apair of electrodes 70, 71. The first electrode 70 may include a firstupper electrode 70 a arranged on an upper surface 7 a of the substrate 7and a first lower electrode 70 b arranged on a lower surface 7 b of thesubstrate 7, as shown in FIG. 3. The first upper electrode 70 a and thefirst lower electrode 70 b may be electrically connected by a firstthrough-hole 70 c. Also, the second electrode 71 may include a secondupper electrode 71 a arranged on the upper surface 7 a of the substrate7 and a second lower electrode 71 b may be electrically connected by asecond through hole 71 c. The light-emitting element 1 may beelectrically mounted on the first upper electrode 70 a and the secondupper electrode 71 a through bumps. It is possible to electrically mountthe light-emitting element 1 on the upper surface 7 a of the substrate 7by wires. However, when laterally emitted light is considered to beused, a light-emitting element 1 at its lower surface 1 b mounted on asubstrate through bumps may be more efficient, compared with alight-emitting element electrically connected to the substrate by ametallic wire that may extend from an upper surface 1 a of thelight-emitting element 1 to an electrode on a substrate, because thebumps disposed at the lower surface 1 b of the light-emitting element 1are considered not to interrupt light emitted upward and/or laterallyfrom the light-emitting diode element 1.

The light-transmitting resin 4 sealing the light-emitting element 1 andthe frame 3 including a phosphor 2 form a light-emitting parallelepiped43 on the substrate 7. The upper surface 3 a of the frame 3 and theupper surface of the light-transmitting resin 4 are flush with eachother to form an upper surface 43 a of the light-emitting parallelepiped43. Also, the peripheral side surface of the light-transmitting resin 4and a peripheral side surface 7 c of the substrate 7 may be flush withone another. The inner side surface 3 c and the outer side surface 3 dof the frame 3′ are covered by the light-transmitting resin 4.

As shown in FIG. 2 and FIG. 3, the substrate 7′ may include a cutportion 7 d that is cut into an upper surface 7 a of the substrate 7′.In this case, the cut portion 7 d may have a shape corresponding to alower surface 3 b of the frame 3′. The frame 3′ includes phosphor layers32′ that are positioned to face the peripheral side surface 1 c of thelight-emitting element 1.

Accordingly, the lower surface 3 b of the phosphor layers 32′ of theframe 3′ can be positioned in the cut portion 7 b of the substrate 7′.This configuration may enhance structural integrity of the phosphorlayers 32′ of the frame 3′, the substrate 7′ and the light-transmittingresin 4 arranged inside the frame 3′ and/or the light-transmitting resin4(4′) arranged outside the frame 3′.

FIG. 4 shows a top plan view of alighting device 300 that can beaccording to the first embodiment and/or the second embodiment. Thelight-emitting element 1 is arranged in a center of quadrilateral area40. The quadrilateral area 40 includes a square area. The frame 3(3′)includes phosphor layers 32 that are positioned to face the peripheralside surface 1 c of the light-emitting element 1 to have substantiallysame thickness to each other indirection facing the peripheral sidesurface 1 c of the light-emitting element 1. The term “substantiallysame thickness” here includes manufacturing variations of thickness.Furthermore, the light-transmitting resin 4 (here shown as 4′) providedin contact with the outer side surface 3 d of the frame 3(3′) mayinclude a diffuser. With this configuration, lateral light emittedthrough the phosphor layer can be diffused effectively.

FIG. 5 shows a top perspective view of a lighting device 400 accordingto a third embodiment of the present invention, and FIG. 6 is across-sectional view taken along a line VI-VI of the lighting device 400shown in FIG. 5. In this third embodiment, the lighting device 400further includes a phosphor layer 33 that includes a phosphor 2 and thatis disposed on an upper surface 43 a of the light-emittingparallelepiped 43 formed by the light-transmitting resin 4 and the frame3 on the substrate 7. The lower surface 3 b of the frame 3 that includesa phosphor 2 may be in contact with an upper surface 7 a of thesubstrate 7 similarly to the first embodiment or may be positioned in acut portion 7 b of the substrate 7′ similarly to the second embodiment.The lighting device 400 according to this embodiment can be configuredto emit laterally from the four phosphor layers 32 that surround thelight-emitting element 1 and also upwardly through the phosphor layer 33that is disposed on the upper surface 43 a of the light-emittingparallelepiped 43. FIG. 6 also shows directions of light roughly: P1shows light emitted from the light-emitting element 1 and P2 shows lightafter being transmitted through a phosphor layer 32 and/or a phosphorlayer 33.

FIG. 7 shows a top perspective view of a lighting device 500 accordingto a fourth embodiment of the present invention and FIG. 8 shows across-sectional view taken along a line VIII-VIII of the lighting device500 shown in FIG. 7.

In this fourth embodiment, the lighting device 500 further includes alight-reflecting layer 5 that is disposed on an upper surface 43 a ofthe light-emitting parallelepiped 43 formed by the light-transmittingresin 4 and the frame 3 on the substrate 7′. The light-reflecting layer5 is configured to reflect light that is emitted upward from thelight-emitting element 1. The reflected light by the light-reflectinglayer 5 may be used as lateral light emitted from the lighting device500 with the light-reflecting layer 5. The light-reflecting layer 5 canbe provided, when light emitted upward from the light-emitting device500 is unnecessary.

FIG. 8 also shows directions of light roughly: P1 shows light emittedfrom the light-emitting element 1 and P2 shows light after beingtransmitted through a phosphor layer 32′.

The lower surface 3 b of the frame 3 may be in contact with an uppersurface 7 a of the substrate 7 similarly to the first embodiment or thelower surface 3 b of the frame 3′ may be positioned in a cut portion 7 bof the substrate 7′ similarly to the second embodiment. The lightingdevice 500 according to the fourth embodiment can be configured to emitlight laterally from the four phosphor layers 32′ that surround thelight-emitting element 1 efficiently. The light-emitting device 500 maybe electrically disposed on a motherboard 8 (shown as dotted line) of anelectronic device or a lighting system.

FIG. 9A to FIG. 9D show a first method embodiment according to method ofmanufacturing a lighting device related to the first embodiment oflighting device and the second embodiment of lighting device of thepresent invention. The substrate 7 may include a pair of electrodes 70,71, similarly to the substrate 7 shown in FIG. 3.

In this embodiment, the method manufacturing a lighting device includesmounting a light-emitting element 1 on a substrate 7 and electricallyconnected to the substrate 7, sealing the light-emitting element 1 onthe substrate 7 by a light-transmitting resin 4, dicing thelight-transmitting resin 4 vertically and horizontally to form a groove30 that surrounds the light-transmitting element 1, and filling aphosphor-containing resin into the groove 30 to form a frame 3 of thephosphor-containing resin. The light-emitting element 1 may beelectrically connected to a first upper electrode 70 a and a secondupper electrode 71 a of the pair of electrodes 70, 71 of the substrate 7by bumps, for example.

The grooves 30 may be formed to reach to an upper surface 7 a of thesubstrate 7. In a variation, the grooves 30 may be formed to be cut intoan upper surface 7 a of the substrate 7.

For more details, FIG. 9A shows the light-emitting element 1 beingmounted on the substrate 7. The light-emitting element 1 can beelectrically connected to electrodes 70, 71 of the substrate 7 by a wireand/or a bump when the light-emitting element 1 is mounted on thesubstrate. Also, the substrate 7 here can be a lead frame to which thelight-emitting element 1 is electrically connected. FIG. 9B shows thelight-emitting element 1 being sealed by the light-transmitting resin 4.FIG. 9C shows the light-transmitting resin 4 being diced to form grooves30 surrounding the light-emitting elements 1. The grooves 30 cut intothe light-transmitting resin 4 includes a quadrilateral shape whenviewed from above. FIG. 9D shows a lighting device with a frame 3 afterthe grooves 30 that are cut through the light-transmitting resin 4 arefilled by a phosphor-containing resin 3. If the grooves 30 are providedto cut through the light-transmitting resin 4 and cut into an uppersurface 7 a of the substrate 7, the lighting device manufacturedaccording to this method can be the lighting device 200 shown in FIG. 2.The grooves 30 filled with the phosphor-containing resin are configuredto be a frame 3 of the lighting device. The lighting device can beconfigured to emit light laterally through a phosphor layer 32 and emitlight upward without passing through a phosphor layer 32. With thisconfiguration, since the light-emitting element 1 at its peripheral sidesurface 1 c is surrounded by the phosphor layers 32, the lighting devicemay emit different color of light depending on its directions (in anupward direction and in a lateral direction of the lighting device).

Also, FIG. 9A to FIG. 9E show a second method embodiment according tomethod of manufacturing a lighting device related to the lighting deviceshown in FIG. 5.

In this embodiment, the method manufacturing a lighting device 400includes mounting a light-emitting element 1 on a substrate 7 andelectrically connected to the substrate 7, sealing the light-emittingelement 1 on the substrate 7 by a light-transmitting resin 4, dicing thelight-transmitting resin 4 vertically and horizontally to form grooves30 that surrounds the light-transmitting element 1, filling aphosphor-containing resin into the grooves 30 to form a frame 3 of thephosphor-containing resin, and disposing a phosphor layer 33 on an uppersurface 43 a of a light-emitting parallelepiped 43 formed by thelight-transmitting resin 4 and the frame 3.

The upper surface 43 a of the light-emitting parallelepiped 43 is formedby the upper surface of the light-transmitting resin and the uppersurface of the frame 3 that are flush with each other. The phosphorlayer 33 can be formed on the upper surface 43 a of the light-emittingparallelepiped 43 by printing a phosphor-containing resin. Instead, itis possible to arrange a phosphor layer 33 in a form of plate on theupper surface 43 a of the light-transmitting resin and the upper surfaceof the grooves 30 filled by the phosphor-containing resin 3.

FIG. 9A to FIG. 9E′ (instead of 9E) show a third method embodimentaccording to method of manufacturing a lighting device related to thelighting device shown in FIG. 7.

The lighting device can be manufactured to emit light laterally througha phosphor layer 32. The lighting device including a light-reflectinglayer 5 can use upward light as laterally emitted light. In thisembodiment, the method manufacturing a lighting device 500 includesmounting a light-emitting element 1 on a substrate 7 and electricallyconnected to the substrate 7, sealing the light-emitting element 1 onthe substrate 7 by a light-transmitting resin 4, dicing thelight-transmitting resin 4 vertically and horizontally to form grooves30 that surround the light-transmitting element 1, filling aphosphor-containing resin into the grooves 30 to form a frame 3 of thephosphor-containing resin, and disposing a light-reflecting layer 5 onan upper surface of a light-emitting parallelepiped 43 formed by thelight-transmitting resin 4 and the frame 3.

FIG. 10 is a cross-sectional view of a lighting device 600 according toa fifth embodiment of the present invention.

FIG. 11 is a top plan view of the lighting device 600 shown in FIG. 10with the light-reflecting layer 5 removed.

The lighting device 600 includes a light-emitting element 1, a frame 60including a phosphor 2 that can be excited by light emitted from thelight-emitting element 1.

The frame 60 has an inner side surface 60 c surrounding thelight-emitting element 1 and an outer side surface 60 d that ispositioned outside the inner side surface 60 c. The inner side surface60 c that demarcates a quadrilateral area 40. The lighting device 600further includes a light-transmitting resin 4 arranged in thequadrilateral area 40 demarcated by the inner side surface 60 c of theframe 3 and sealing the light-emitting element 1 that is positionedinside the quadrilateral area 40. The light-transmitting resin 4 beingfurther provided in contact with an outer side surface 60 d of the frame60. The light-transmitting resin 4 that is arranged in the quadrilateralarea 40 demarcated by the inner side surface 60 c of the frame 3 and thelight-transmitting resin 4 provided in contact with the outer sidesurface 60 d of the frame 60 are separated from each other by the frame60.

As shown in FIG. 10, two pairs of parallel phosphor layers 62 form theframe 60 of a quadrilateral shape without a crossing portion, and thephosphor layers 62 of the frame 60 are entirely sealed by thelight-transmitting resin 4. The frame 60 may be embedded in thelight-transmitting resin 4.

Furthermore, the light-transmitting resin 4 provided in contact with theouter side surface 60 d of the frame 60 may include a diffuser. Withthis configuration, lateral light emitted through the phosphor layer canbe diffused effectively. To achieve this configuration,light-transmitting resin 4′ provided in contact with the outer sidesurface 3 d of the frame 3 may be formed separately from thelight-transmitting resin 4 filled inside the frame 60.

FIG. 12A to 12D show a fourth method embodiment according to method ofmanufacturing a lighting device related to the lighting device shown inFIG. 10 and FIG. 11. The method of this embodiment includes mounting alight-emitting element 1 on a substrate 7, forming a frame that includesa phosphor to surround the light-emitting element 1, and sealing theframe 60 and the light-emitting element 1 on the substrate 7.

For more details, FIG. 12A shows a light-emitting element 1 mounted onan upper surface of the substrate 7. The substrate 7 can include a pairof electrodes 70, 71 similarly to the lighting device 200 shown in FIG.3. When the light-emitting element 1 is mounted on the substrate 7, thelight-emitting element maybe electrically connected to the pair ofelectrodes 70, 71 by a bump and/or metallic wire. The shape and/ornumber of electrodes can be changed, and use of lead frame instead ofuse of substrate is also available, and that are not limited toembodiments.

FIG. 12B shows that a frame 60 including a phosphor 2 may be formed byuse of a molding die. The frame 60 can be formed to surround thelight-emitting element 1 on the substrate 7. The frame 60 that isarranged on an upper surface 7 a of the substrate 7 is positioned insidea peripheral upper surface portion 7 a′ of the frame 60.

FIG. 12C shows that the frame 60 and the light-emitting element 1 aresealed by the light-transmitting resin 4. The light-transmitting resin 4may be formed by use of a molding die. Also, it is possible to form thelight-transmitting resin 4 inside the frame 60 and outside the frame 60separately. The light-transmitting resin 4 outside the frame 60 caninclude a diffuser to form a light-transmitting parallelepiped 43′.

FIG. 12D shows that a light-reflecting layer 5 or a phosphor layer 33being formed on an upper surface 43′a of the light-transmittingparallelepiped 43′ of the light-transmitting resin 4.

FIG. 13A to 13F show a fifth method embodiment according to methodmanufacturing a lighting device collectively. The method manufacturing alighting device comprising of this embodiment includes mountinglight-emitting elements 1 on a substrate assembly 7L, sealing thelight-emitting elements on the substrate assembly 7L by alight-transmitting resin to form a light-transmitting resin assembly 4L,dicing the light-transmitting resin assembly 4L vertically andhorizontally to form grooves 30 that surrounds the light-emittingelements 1, and filling a phosphor-containing resin into the grooves 30to form a frame assembly 3L that comprises frames 3 of thephosphor-containing resin.

The substrate assembly 7L includes an electrode pattern and can bedivided into substrates 7 each of that can have a quadrilateral shapewith a pair of electrodes 70, 71. When the light-emitting elements 1 aremounted on the substrate assembly 7L, the light-emitting elements 1 canbe electrically connected to the pair of electrodes 70, 71 that isincluded in the electrode pattern arranged on the substrate assembly 7L.

The method of this embodiment may further include dicing through thelight-transmitting resin assembly 4L and the substrate assembly 7L atpositions between the frames 3 of the frame assembly 3L to divide intolighting devices with the frames 3.

When the light-transmitting resin assembly 4L is diced through, an uppersurface 7La of the substrate assembly 7L may be diced into to form a cutportion 7 d (as shown in FIG. 2 and FIG. 3). The light-transmittingresin 4L is diced vertically and horizontally to form grooves, and cutportion 7 d cut into the upper surface 7La of the substrate assembly 7Lare simultaneously formed at the grooves.

Furthermore, the method may further includes forming a phosphor layerassembly 33L on an upper surface 43La of the light-transmittingassemblage 43L of the light-transmitting resin assembly 4L with theframe assembly 3L, and dicing through the phosphor layer assembly 33L,the light-transmitting assemblage 43L of the light-transmitting resinassembly 4L with the frame assembly 3L and the substrate assembly 7L atpositions c between the frames 3 of the frame assembly 3L to divide intolighting devices 400 with the frames 3 and phosphor layers 33.

As a variation, the method may further includes forming alight-reflecting layer assembly 5L on an upper surface 43La of thelight-transmitting assemblage 43L of the light-transmitting resinassembly 4L with the frame assembly 3L, and dicing through thelight-reflecting layer assembly 5L, the light-transmitting assemblage43L of the light-transmitting resin assembly 4L with the frame assembly3L and the substrate assembly 7L at positions c between the frames 3 ofthe frame assembly 3L to divide into lighting devices 500 with theframes 3 and light-reflecting layers 5.

Since the frame of the lighting device includes a quadrilateral phosphorlayer shape that surrounds the light-emitting element, it can be easy tomanufacture the light-emitting device with the frame by use of a methodof manufacturing a lighting device collectively according to anembodiment of the present invention, for example.

Furthermore, while certain embodiments of the present inventive subjectmatter have been illustrated with reference to specific combinations ofelements, various other combinations may also be provided withoutdeparting from the teachings of the present inventive subject matter.Thus, the present inventive subject matter should not be construed asbeing limited to the particular exemplary embodiments described hereinand illustrated in the Figures, but may also encompass combinations ofelements of the various illustrated embodiments.

Many alterations and modifications may be made by those having ordinaryskill in the art, given the benefit of the present disclosure, withoutdeparting from the spirit and scope of the inventive subject matter.Therefore, it must be understood that the illustrated embodiments havebeen set forth only for the purposes of example, and that it should notbe taken as limiting the inventive subject matter as defined by thefollowing claims. The following claims are, therefore, to be read toinclude not only the combination of elements which are literally setforth but all equivalent elements for performing substantially the samefunction in substantially the same way to obtain substantially the sameresult. The claims are thus to be understood to include what isspecifically illustrated and described above, what is conceptuallyequivalent, and also what incorporates the essential idea of theinventive subject matter.

What is claimed is:
 1. A lighting device comprising: a light-emittingelement; a frame comprising a phosphor that can be excited by lightemitted from the light-emitting element, the frame having an inner sidesurface surrounding the light-emitting element and an outer side surfacebeing positioned outside the inner side surface that demarcates aquadrilateral area; and a light-transmitting resin arranged in thequadrilateral area demarcated by the inner side surface of the frame andsealing the light-emitting element that is positioned inside thequadrilateral area, and the light-transmitting resin being furtherprovided in contact with the outer side surface of the frame.
 2. Thelighting device according to claim 1, wherein the light-transmittingresin that is arranged in the quadrilateral area demarcated by the innerside surface of the frame and the light-transmitting resin provided incontact with the outer side surface of the frame are separated from eachother by the frame.
 3. The lighting device according to claim 2, whereinthe light-transmitting resin provided in contact with the outer sidesurface of the frame comprises a diffuser.
 4. The lighting deviceaccording to claim 1, wherein the outer side surface of the framepositioned outside and opposite to the inner side surface thatdemarcates a quadrilateral area is covered by the light-transmittingresin.
 5. The lighting device according to claim 1 further comprising: asubstrate comprising a pair of electrodes, and the light-emittingelement being electrically connected to the pair of electrodes of thesubstrate.
 6. The lighting device according to claim 1 furthercomprising: a substrate comprising a pair of electrodes and a cutportion that is cut into the upper surface of the substrate; thelight-emitting element being electrically connected to the pair ofelectrodes of the substrate, and a lower surface of the frame beingpositioned in the cut portion of the substrate.
 7. The lighting deviceaccording to claim 1, wherein the frame includes four phosphor layerswith the inner side surface that faces a peripheral side surface of thelight-emitting element, and the four phosphor layers of the frame has asubstantially same thickness to each other in direction facing theperipheral side surface of the light-emitting element.
 8. The lightingdevice according to claim 1, wherein the frame comprises a crossingportion at a corner of the frame.
 9. The lighting device according toclaim 3, wherein the light-transmitting resin and the frame comprisingthe phosphor form a light-emitting parallelepiped on the substrate. 10.The lighting device according to claim 7 further comprising: a phosphorlayer comprising a phosphor and disposed on an upper surface of thelight-emitting parallelepiped on the substrate.
 11. The lighting deviceaccording to claim 7 further comprising: a light-reflecting layerdisposed on an upper surface of the light-emitting parallelepiped on thesubstrate.
 12. The lighting device according to claim 4, wherein thelight-transmitting resin and the frame comprising the phosphor form alight-emitting parallelepiped on the substrate.
 13. The lighting deviceaccording to claim 10 further comprising: a light-reflecting layerdisposed on an upper surface of the light-emitting parallelepiped on thesubstrate.
 14. A lighting device comprising: a light-emitting element; aframe comprising a phosphor that can be excited by light emitted fromthe light-emitting element, the frame having an inner side surfacesurrounding the light-emitting element and an outer side surface beingpositioned outside the inner side surface that demarcates aquadrilateral area; and a substrate comprising a pair of electrodes anda cut portion that is cut into the upper surface of the substrate; thelight-emitting element being electrically connected to the pair ofelectrodes of the substrate, and a lower surface of the frame beingpositioned in the cut portion of the substrate.